ደረጃ በደረጃ የተዋቀረ የስልጠና ፍኖተ ካርታ
እያንዳንዱ ሞጁል የሰርኪውት ንድፈ-ሀሳብን ከተግባራዊ የላብራቶሪ ምዕራፎች ጋር ያጣምራል።
Module 1: Safety, Precision Tools & Hardware Teardown
ESD ground isolation, precision screwdrivers, heating plates, and safe battery extraction.
የሚዳሰሱ ርዕሶች፡
- Workstation safety & ground loop prevention
- Heating plate & hot air adhesive softening
- Display, frame, and battery extraction
- Micro-bracket and screw organization
Perform clean teardown and reassembly of iPhone and Android test units.
Module 2: Multimeter Diagnostics & Primary Power Rails
Diode mode drop testing on FPC connectors, schematic reading, and DC power supply current draw analysis.
የሚዳሰሱ ርዕሶች፡
- Diode mode readings vs reference values
- VBUS, VBAT & VDD_MAIN power sequencing
- DC bench power supply short vs open signatures
- Freeze spray and thermal short isolation
Locate shorted capacitor on main power rail and safely restore boot.
Module 3: Micro-Soldering & Jumper Running
Stereomicroscope soldering, 0.02mm insulated jumper wire routing, and charge port replacement.
የሚዳሰሱ ርዕሶች፡
- Microscope focus and ergonomics
- 0.02mm jumper wire routing for torn pads
- UV-curable solder mask application
- Type-C and micro-USB port rework
Reconstruct torn motherboard pads using jumper wire under magnification.
Module 4: BGA IC Reballing & Software Recovery
Underfill glue removal, BGA stencil reballing, PMIC replacement, and firmware flashing.
የሚዳሰሱ ርዕሶች፡
- Underfill resin softening and scraping
- Direct-heat stencils and solder paste reballing
- Power Management IC (PMIC) replacement
- Firmware flashing and bootloop recovery
Reball and solder back a PMIC chip with verified device boot.
ምን ይማራሉ
በስራ ጠረጴዛ ላይ የሚተገበሩ ክህሎቶች
ለማን የተዘጋጀ፡ Students, technicians, and entrepreneurs launching phone repair shops
ቅድመ ሁኔታዎች፡ No prior experience required
ስለዚህ ስልጠና ይጠይቁ
መረጃዎን ያጋሩ፤ ማዕከሉ ስለ ቀናት፣ መስፈርቶች እና ክፍያዎች ያነጋግርዎታል።